Designed taking full benefit of ST's BCD diffusion technology, the powerSPIN™ motor control platform offers the same performances as an ASIC without requiring the same design complexity and development costs.
The platform is based on an analog control core that manages the specified physical variables (current, speed) required by different motor types (stepper, brushed DC and 3-phase brushless).
The control core also embeds all the protection, sensing and processing blocks (undervoltage, over-temperature, overcurrent) and the optimized buffer stages devoted to correctly drive the 60 V rated integrated power MOSFET.
Power MOSFET are arranged into arrays of either 8 - four high side and four low side - or six - 3 high side and three low side. Both bridge topologies are provided with two different DMOS sizes - with RDS(on) at 0.73 ohm and 0.3 ohm - perfectly fitting two current ratings ranges: 1.4 Arms and 2.8 Arms.
Features
BCD technology, 60 V mixed-signal power technology
Operating supply voltage: 7 to 52 V
Power MOSFET ouput stage:
Typical RDS(on) = 0.3 ohm or 0.73 ohm @ Tj = 25 °C
Intrinsic fast free wheeling diodes
Two product classes covering different current ratings:
L620x and L6235, 5.6 Apeak and 2.8 Arms
L622x, 2.8 Apeak and 1.4 Arms
Parallel operation doubles peak and rms ratings
Extensive protection schemes:
Non-dissipative high-side current sensing for overcurrent protection
Cross conduction protection
Thermal protection
Undervoltage lock out
PowerSO, SO, DIP and QFN package options
New products
L622xQ series:
Extra miniaturized QFN 5x5x1 – 32 leads packages available for L622x series, offer +30% thermal performances and -85% footprint, ideal for applications with space constraints.
powerSPIN family
Design support
To evaluate the powerSPIN motor driver ICs, you can download and install practiSPIN.
practiSPIN is an integrated evaluation environment that allows you to easily assign the appropriate current and speed profile to the selected powerSPIN IC.
